앰코 테크놀로지 (AMKR) 주가 전망: 목표주가, 배당, 최신 뉴스

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific.

It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage.

The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate.

In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services.

It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Amkor Technology, Inc.는 미국, 일본, 유럽 및 아시아 태평양 지역에서 반도체 패키징 및 테스트 아웃소싱 서비스를 제공하는 기업입니다. 1968년에 설립되어 본사는 Tempe, Arizona에 위치해 있습니다.

회사는 turnkey 패키징 및 테스트 서비스(semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level 및 final test, drop shipment 포함)를 제공하며, 스마트폰·태블릿 등 모바일 기기를 위한 flip chip scale package 제품과 메모리·디지털 베이스밴드·애플리케이션 프로세서를 적층하는 flip chip stacked chip scale packages, 네트워킹·스토리지·컴퓨팅·자동차·소비자용 애플리케이션을 위한 flip-chip ball grid array packages, 시스템 메모리나 플랫폼 데이터 저장용 메모리 제품 등을 제조합니다.

또한 wafer-level CSP(전력관리, 트랜시버, 센서, 무선충전, 코덱, 특수 실리콘), wafer-level fan-out(전력관리, 트랜시버, 레이더, 특수 실리콘), silicon wafer integrated fan-out technology(라미네이트 기판을 더 얇은 구조로 대체), leadframe packages, substrate-based wirebond packages, micro-electro-mechanical systems (MEMS) 패키지 및 RF·프론트엔드 모듈, 베이스밴드, 연결성, 지문센서, 디스플레이·터치 드라이버, 센서·MEMS, NAND 메모리 및 SSD에 사용되는 advanced system-in-package 모듈을 제공합니다. 이밖에 wafer·package·system 레벨 테스트 서비스와 burn-in 테스트 및 테스트 개발 서비스도 제공하며, 통합 디바이스 제조업체, 팹리스 반도체 회사, OEM 및 계약 파운드리를 주요 고객으로 두고 있습니다.

• 주소: 2045 East Innovation Circle, Tempe, AZ 85284, United States

• 전화번호: 480 821 5000

• 웹사이트: https://amkor.com

• 섹터: Technology

• 산업: Semiconductor Equipment & Materials

• 직원 수: 30,800